Select Year：
Roll to Roll Process Solution
Cleaning module Precision Coating Module Lamination module Precision hot air baking module UV drying module Winding and unwinding module
WLP/PLP Photoresist Removal Equipment
Specification/Type: HDPR-WLP1000-300/HDPR-PLP1000-500 Substrate size: 200-300mm wafer/ 510mm*510mm Number of chamber: 2-4/ 2 Transfer system: 5-axis dual arm robot
High Cleanliness Surround Radiant Turance
Temperature: Max. 800°C Uniformity: 280°C ± 3°C Cleanliness: Class 10 O2 concentration: 100/50/10 ppm (20 min) Panel Size: 6″/8″/10″/12″