Carrier Bonder
Carrier Bonder
SKU:WVL-A12

- Designed for Temporary Bonding process
 - Superior pressure uniformity
 - Max. pressure : 0.5 MPa
 - Max. temperature : 250℃
 - Flexible process capability : Vacuum Baking / Carrier Bonding
 - Real time process status display
 - SECS/GEM compatible
 
Downloads
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